<?xml version="1.0" encoding="utf-8"?>
<!DOCTYPE eagle SYSTEM "eagle.dtd">
<eagle version="6.3">
<drawing>
<library>
<packages>
<package name="SOIC-14">
</package>
<package name="SOT-23">
</package>
<package name="SOT-23-5">
</package>
<package name="SOT-23-6">
</package>
<package name="SO08">
<description>&lt;b&gt;Small Outline Package&lt;/b&gt; Fits JEDEC packages (narrow SOIC-8)</description>
</package>
<package name="SO014">
</package>
<package name="SO16">
<description>&lt;b&gt;Small Outline package&lt;/b&gt; 150 mil</description>
</package>
<package name="SO16L">
<description>&lt;b&gt;Small Outline Package&lt;/b&gt; .300 SIOC&lt;p&gt;
Source: http://www.maxim-ic.com/cgi-bin/packages?pkg=16%2FSOIC%2E300&amp;Type=Max</description>
</package>
<package name="SOIC-8">
</package>
<package name="SSOP20">
<description>&lt;b&gt;Shrink Small Outline Package&lt;/b&gt;&lt;p&gt;
package type SS</description>
</package>
<package name="SSOP24">
</package>
<package name="QFN-24">
</package>
<package name="QFN-28">
</package>
<package name="QFN-32">
<description>&lt;h3&gt;QFN 32-Pin package w/ Thermal Pad&lt;/h3&gt;
&lt;b&gt;***Unproven***&lt;/b&gt;
&lt;br&gt;&lt;br&gt;
&lt;B&gt;Applicable Parts:&lt;/b&gt;
&lt;ul&gt;&lt;li&gt;TLC5940&lt;/ul&gt;</description>
</package>
<package name="QFN-44">
</package>
<package name="QFN20">
</package>
<package name="SOIC-18">
</package>
<package name="SOT223">
<description>&lt;b&gt;SOT-223&lt;/b&gt;</description>
</package>
<package name="TSSOP-8">
<description>&lt;b&gt;8-Lead Thin Shrink Small Outline Package &lt;/b&gt;&lt;p&gt;
Source: http://www.analog.com/static/imported-files/data_sheets/AD8541_8542_8544.pdf</description>
</package>
<package name="TSSOP-14">
<description>&lt;b&gt;14-Lead Thin Shrink Small Outline Package [TSSOP]&lt;/b&gt;&lt;p&gt;
Source: Analog Devices .. 780914713ADD8704_0.pdf</description>
</package>
<package name="TSSOP-16">
<description>&lt;b&gt;16-Lead Thin Shrink Small Outline Package&lt;/b&gt; [TSSOP] (RU-16)&lt;p&gt;
Source: 8x ADG1408_1409.pdf</description>
</package>
<package name="TSSOP-24">
<description>&lt;b&gt;24-Lead Thin Shrink Small Outline Package TSSOP&lt;/b&gt; (RU-24)&lt;p&gt;
Source: http://www.analog.com/UploadedFiles/Data_Sheets/39677768AD7714_c.pdf</description>
</package>
<package name="TSSOP-28">
<description>&lt;b&gt;28-Lead TSSOP Package&lt;/b&gt;&lt;p&gt;
RU-28</description>
</package>
<package name="TSSOP-38">
<description>&lt;b&gt;38-Lead Thin Shrink Small Outline Package&lt;/b&gt; [TSSOP] RU-38&lt;p&gt;
Source: http://www.analog.com/UploadedFiles/Packages/415413609854197792024125RU38.pdf&lt;br&gt;
COMPLIANT TO JEDEC STANDARDS MS-153BD-1</description>
</package>
</packages>
<symbols>
</symbols>
<devicesets>
</devicesets>
</library>
</drawing>
</eagle>
